Abstract: The influences of stabilizing agent sodium thiosulfate on the stability of plating solution, surface morphology, chemical composition, crystal structure, deposition rate, surface resistance and electromagnetic interference shielding effectiveness (EMI SE) were investigated. The results reveal that the stability of plating solution was significantly improved with addition of sodium thiosulfate. But high concentration of sodium thiosulfate leads to deposit tended to loose. The crystalline structure of silver in deposit is face centered cubic structure. The crystallite size is decreasing with increasing concentration of sodium thiosulfate. The deposition rate decrease with the addition of sodium thiosulfate. However, the sensitivity on temperature of deposition rate increase with the presence of sodium thiosulfate. The deposition rate greatly decrease when the concentration of sodium thiosulfate high than 0.6mg/L. Surface resistance and electromagnetic interference shielding effectiveness had no significantly difference when the concentration of sodium thiosulfate less than 0.4mg/L.