Journal of Textile Research ›› 2023, Vol. 44 ›› Issue (10): 223-231.doi: 10.13475/j.fzxb.20220702902

• Comprehensive Review • Previous Articles     Next Articles

Research progress in design methods for semiconductor cooling garments

NIE Sixuan, YIN Hu(), NIE Yadong   

  1. Beihang University, Beijing 100191, China
  • Received:2022-07-11 Revised:2022-09-28 Online:2023-10-15 Published:2023-12-07

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Abstract:

Significance Thermal damage and workplace accidents caused by working under high temperatures occur frequently. With advantages of portability, controllability,and environmental protection, semiconductor refrigeration garments are more suitable for use in the working scene. The semiconductor cooling garments can regulate the temperature and humidity of the human micro-environment and reduce the thermal discomfort of workers working in hot environments. This paper summarizes the methods to improve the efficiency and thermal comfort of semiconductor cooling garments which can help save energy and improve the wearing experience. The methods can be used as the basis for further experiments and design.

Progress The semiconductor cooling garment can be divided into a cold source module (including the refrigeration part and the heat dissipation part of the hot end) and a heat transfer module of the cold end. For the cold source module, ways to enhance the cooling efficiency involve altering the input and improving heat dissipation at the hot end. The heat dissipation methods of the hot end include forced air cooling, liquid cooling, and heat pipe cooling, different heat dissipation methods have their ways to improve the heat dissipation performance of the hot end, such as changing fan voltage, changing liquid and phase change medium. For the heat transfer module of the cold end, the heat transfer modes include liquid heat transfer, air heat transfer, and contact heat transfer. The appropriate heat transfer mode can be selected according to the working conditions and characteristics of different heat transfer modes. The parameters related to the structure and medium of the heat transfer part are the important factors affecting the heat transfer efficiency and thermal comfort. Thermal comfort experiment is an important way to evaluate and optimize cooling garments. In addition to the results obtained from the human clothing experiment, establishing the thermal comfort model of the human body-cooling garment-environment is an efficient analysis and processing method.

Conclusion and Prospect The factors influencing the cooling efficiency and thermal comfort of the semiconductor cooling garments were summarized from various aspects, which provided ideas for the design, optimization, and component selection of semiconductor cooling garments. For the cold source module, to improve the refrigeration efficiency, it is necessary to find the best input voltage and current of different types of cold sources, and conduct voltage input in a controllable and intelligent way. The heat dissipation mode shall be selected based on the weight, volume, and heat dissipation requirements. For the heat transfer part, the weight, efficiency, and thermal comfort of different heat transfer modes need to be considered. For air heat transfer, the heat loss can be reduced and the heat transfer performance can be improved by optimizing the air duct structure, changing the air temperature, wind speed, and air volume and reasonably designing the circulation space. For liquid heat transfer, it is necessary to select an appropriate liquid flow medium, optimize the structure of the liquid cooling pipeline, change the liquid flow rate, inlet temperature, and other parameters, and reduce the weight and volume as much as possible. For contact heat transfer, a comfortable and soft tactile experience is essential, and local supercooling needs to be prevented. The variables of the comfort experiment can not only change the parameters of the device, but also change the experimental environment and explore the human differences to ensure that the cooling clothing can adapt to the thermal comfort requirements under different working conditions. The human experiments and comfort models are both methods to solve the influence of variables. The comfort model can also be used for cold source optimization and comfort prediction. Lightweight, intelligent and comfortable semiconductor cooling garments that are suitable for multiple scenes will become the future research direction.

Key words: semiconductor refrigeration, cooling garment, thermal comfort, heat transfer form, heat dissipation method

CLC Number: 

  • TS941.731

Tab. 1

Comparison of three heat dissipation methods"

散热方式 优点 缺点
风冷散热 装置简单,质量轻,可提高制冷服的便携性 噪声大,振动大,散热效率低于液冷散热和热管散热,适用于小功率制冷服
液冷散热 噪声和震动小,散热效率高,速度快 需要电源、水泵等支持,装置复杂、质量大,耗电量大,成本高,易结露,易泄漏[23]
热管散热 散热效率极佳,散热装置较紧凑,体积相对较小 一般仍需要配合风冷等其它散热方式,成本较高

Fig. 1

Form of liquid heat transfer"

Fig. 2

Form of air heat transfer"

Fig. 3

Spiral (a), horizontal (b) and vertical (c) air-cooled clothing"

Fig. 4

Different air shunt positions of Y-shaped air distribution system. (a) Position 1; (b) Position 2; (c) Position 3"

Fig. 5

Baffle type(a), flow sharing type(b) and direct blowing type(c) air inlet"

Tab. 2

Comparison of three heat transfer methods"

传热方式 优点 缺点
液冷传热 液体的比热高,液冷换热的效率较高。适用于制冷功率高的场景 1) 装置比较复杂,需要水泵、储液箱等;质量较大,便携性差
2) 液冷装置耗电量较高
3) 液体介质有泄漏危险,安全性较低
4) 液冷可能会导致服装微气候的湿度升高,影响人体舒适度
风冷传热 便携性高,质量轻,提高了穿戴者的机动性,而且冷却速度快。适用于需要便携或劳动强度较大的场景 1) 气体的自由度比较高,气冷的热损失却很大
2) 气体的比热低于液体,仅通过传导或对流散热,效率较低
3) 由于空气的大流动性,空气的温度很难控制,风冷系统的尺寸、质量、噪声和能量转换效率等问题限制了风冷服使用
接触传热 降低了在传热过程中的热损失,能显著提高降温效果和降温效率。适用于小面积局部制冷 1) 无法实现大面积制冷,导致冷量分配不均匀,易出现局部过冷的状况
2) 普通半导体冷却板的外表面为硬质陶瓷,会给佩戴者带来不适,从而影响使用者的热舒适性[42]
3) 使用柔性半导体模块的服装一般不包括散热部分,这限制了其在体育等应用中的潜力,无法适应密集的体力活动的应用场景[9]
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