Journal of Textile Research ›› 2022, Vol. 43 ›› Issue (10): 89-96.doi: 10.13475/j.fzxb.20210905708

• Dyeing and Finishing & Chemicals • Previous Articles     Next Articles

Influencing factors on flexible fabric-based electrical circuit formation by micro-jet printed primary cell replacement deposition

XIAO Yuan1,2(), LI Qian1, ZHANG Wei1, HU Hanchun1, GUO Xinlei1   

  1. 1. College of Mechanical and Electrical Engineering, Xi'an Polytechnic University, Xi'an, Shaanxi 710048, China
    2. Xi'an Key Laboratory of Modern Intelligent Textile Equipment, Xi'an, Shaanxi 710048, China
  • Received:2021-09-15 Revised:2022-03-17 Online:2022-10-15 Published:2022-10-28

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Abstract:

In view of the problems of complicated process, high cost, poor integration with textiles existing in the preparation of flexible electrical circuits in smart textiles, a method of micro-jet printing primary cell replacing deposit fabric-based electrical circuits is proposed. Based on the use of the piezoelectric micro-droplet ejection system, the effects of the concentration and mass of silver nitrate and ascorbic acid and the selection of anode substrate on morphology and square resistance for the formed circuits were studied. The results show that under stable ejection conditions, the fabric-based electrical circuits can be prepared using the proposed method. When the mass concentration of silver nitrate solution is 0.5 g/mL and that of ascorbic acid is 0.3 g/mL, the number of silver nitrate printing layers is 4, and the mass ratio of fabric to ascorbic acid solution is 1∶2, the obtained square resistance and standard deviation of the formed silver circuits are 0.047 8 Ω/□ and 0.009 138 Ω/□, respectively. When copper was applied for the base board, the silver layers on the surface of fabric substrate are uniform and dense with large silver particle size, and the average square resistance and variance of the obtained silver circuits became smaller.

Key words: smart textile, micro-droplet jetting, primary cell replacement deposition, flexible circuit, silver nitrate

CLC Number: 

  • TH16

Fig.1

Piezoelectric droplet ejection system"

Fig.2

Principle of micro-jet printing primary cell replacement deposition forming silver circuits"

Fig.3

Silver nitrate solution stable ejection process"

Tab.1

Experiment scheme"

方案
编号		 硝酸银溶
液质量
浓度/
(g·mL-1)		 抗坏血酸
溶液质
浓度/
(g·mL-1)		 硝酸银溶
液打印层
数		 织物与抗
坏血酸溶
液质量比		 金属基板
类型
1 0.1~0.9 0.3 4 1∶2 铜箔
2 0.5 0~0.5 4 1∶2 铜箔
3 0.5 0.3 1~6 1∶2 铜箔
4 0.5 0.3 4 1∶1~1∶4 铜箔
5 0.5 0.3 4 1∶2 无基板、
铜箔、锌
箔、锡箔

Fig.4

Forming silver circuits under different deposition conditions. (a) Silver nitrate solution in different mass concentration; (b) Ascorbic acid solution in different mass concentration; (c) Different printing layers; (d) Ascorbic acid solutions in different mass; (e) Different metal substrates"

Fig.5

SEM images of silver circuits formed by silver nitrate solution of different mass concentration"

Fig.6

Square resistance of silver circuits formed by silver nitrate solution of different mass concentration"

Fig.7

SEM images of silver circuits formed by ascorbic acid solution of different mass concentration"

Fig.8

Square resistance of silver circuits formed by ascorbic acid solution of different mass concentration"

Fig.9

SEM images of silver circuits by silver nitrate solution with different printing layers. (a) Printing 1 layer;(b) Printing 2 layers; (c) Printing 3 layers; (d) Printing 4 layers; (e) Printing 5 layers; (f) Printing 6 layers"

Fig.10

Square resistance of silver circuits by silver nitrate solution with different printing layers"

Fig.11

SEM images of silver circuits formed by different mass ratios of fabric to ascorbic acid solution"

Fig.12

Square resistance of silver circuits formed by different mass ratios of fabric to ascorbic acid solution"

Fig.13

SEM images of silver circuits formed by different metal substrates. (a) No substrate; (b) Cu substrate;(c) Zn substrate; (d) Sn substrate"

Fig.14

Square resistance of silver circuits formed by different metal substrates"

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